74HCT240PW,112

Overview

The 74HCT240PW,112 is an octal buffer and line driver manufactured by Nexperia USA Inc. It belongs to the 74HCT logic family, utilizing CMOS technology with TTL-compatible input levels. The device features two independent groups of four outputs, each controlled by a separate output enable input. All outputs are three-state, allowing connection to bus systems without external drivers. It operates within a supply voltage range of 4.5 V to 5.5 V and is housed in a 20-pin TSSOP package.

Feature Summary

• Octal buffer configuration with dual four-bit sections
• Three-state outputs for bus-oriented applications
• TTL-compatible input levels for direct interface with TTL logic
• Independent output enable controls for each group

Applications

• Bus-oriented memory and address drivers
• Clock drivers and buffer circuits
• Line drivers for high-noise environments
• Bidirectional data bus transceivers when paired with compatible devices

Procurement Notes

Verify the specific suffix '112' against the manufacturer's current datasheet to confirm package type and availability status. Ensure the HCT variant is required for TTL compatibility rather than HC. Confirm RoHS compliance and lead times with authorized distributors as production cycles may vary.

Selection Notes

Select this component when TTL-level interfacing is necessary with CMOS loads. The HCT series ensures compatibility with standard 5V TTL inputs while offering CMOS drive capabilities. Consider the TSSOP package for surface-mount assembly requirements and verify thermal dissipation needs for the operating environment.

Part Context

This part is part of the 74HCT240 family of octal buffers. It shares functional similarities with the 74HC240 but differs in input threshold voltages to support TTL logic families. The PW suffix indicates the TSSOP package style, distinguishing it from SO or other package variants within the same logical function.

Replacement Considerations

Direct substitutes include 74HCT240D and 74HCT240N, provided the package footprint matches the design constraints. Verify that any replacement maintains the three-state output functionality and TTL input compatibility.