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Product Detailed Parameters
- Description:IC BUFFER INVERT 3.6V 20SOIC
- Series:74LCX
- Mfr:onsemi
- Package:Tape & Reel (TR),Tape & Reel (TR),Cut Tape (CT)
- Logic Type:Buffer, Inverting
- Number of Elements:2
- Number of Bits per Element:4
- Input Type:-
- Output Type:3-State
- Current - Output High, Low:24mA, 24mA
- Voltage - Supply:2V ~ 3.6V
- Operating Temperature:-40°C ~ 85°C (TA)
- Mounting Type:Surface Mount
- Package / Case:20-SOIC (0.295", 7.50mm Width)
- Supplier Device Package:20-SOIC
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Overview
The onsemi 74LCX240WMX is a low voltage octal buffer and line driver with 5 V tolerant inputs and outputs. It operates within a supply voltage range of 1.65 V to 5.5 V, featuring propagation delays as low as 6.5 ns at 3.3 V. The device provides ±24 mA output drive capability and supports live insertion/withdrawal through power-down high impedance states.
Feature Summary
- Features 5 V tolerant inputs and outputs for interfacing with 5 V signal environments
- Implements proprietary noise and EMI reduction circuitry
- Supports live insertion and withdrawal via power-down high impedance state
Applications
- Memory address driver
- Clock driver
- Bus oriented transmitter or receiver
Procurement Notes
Verify the specific package variant (SOIC-20W vs TSSOP-20) matches the design footprint. Confirm RoHS compliance and Pb-Free status requirements. Ensure input pull-up resistors are sized correctly to maintain high-impedance during power transitions.
Selection Notes
Select this component for applications requiring low voltage operation with 5 V compatibility. Consider the 6.5 ns maximum propagation delay for high-speed bus applications. Evaluate the ±24 mA drive strength against load capacitance requirements.
Part Context
Part of the LCX family designed for low voltage CMOS applications. Fabricated with advanced CMOS technology to achieve high speed while maintaining low power dissipation. Offers latch-up performance exceeding 100 mA and ESD protection greater than 2000 V.
Replacement Considerations
Check pinout compatibility with existing designs. Verify voltage tolerance levels match system requirements. Ensure thermal characteristics align with board layout constraints.
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