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74LCX573SJ is listed in the Latches range at ChipApex. The manufacturer field lists Fairchild Semiconductor. Its product description is IC D-TYPE TRANSP SGL 8:8 20SOP. Review the specifications below when checking this part for your BOM.
The Fairchild Semiconductor 74LCX573SJ is an octal D-type transparent latch featuring three-state outputs, belonging to the 74LCX logic family. It operates within a supply voltage range of 2.0V to 3.6V and supports a maximum operating temperature of +85°C with a minimum of -40°C. The device utilizes a 20-pin TSSOP package measuring 6.5mm in length, 4.4mm in width, and 0.9mm in height. It provides both non-inverting and inverting polarity options for its eight-bit data path.
Verify the specific suffix 'SJ' against official Fairchild or ON Semiconductor documentation to confirm pinout compatibility and tape-and-reel specifications. Ensure the component meets RoHS compliance requirements if mandated by your assembly standards. Cross-reference the manufacturer part number with current datasheets to validate active status and lead-free material declarations before finalizing procurement orders.
Select this component when interfacing low-voltage logic with 5V tolerant environments is required. The 74LCX series offers superior speed compared to standard HC logic while maintaining CMOS power efficiency. Verify that the 2.0V to 3.6V supply range aligns with your system's power rails and that the TSSOP package fits your PCB footprint constraints.
This device is part of the broader 74LCX logic family, designed for low-voltage applications. It shares functional similarities with other octal latches like the 74HC573 but operates at lower voltages. The 74LCX series is widely used in portable electronics and battery-powered devices due to its energy-efficient characteristics and compatibility with modern low-voltage microcontrollers.
Check for equivalents such as MM74LCX573MTCX or MC74LCX573DW. Confirm that substitute parts maintain identical pin configurations and electrical characteristics. Verify package dimensions and thermal performance to ensure seamless integration without redesigning the host circuit board.
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