74LCXH16374MEA

Overview

The onsemi 74LCXH16374MEA is a low-voltage 16-bit D-type flip-flop featuring dual 8-bit elements with three-state outputs. It operates within a supply voltage range of 2V to 3.6V and supports a maximum clock frequency of 170 MHz. The device exhibits a typical propagation delay of 6.2 ns at 3.3V with 50pF load. Quiescent current is limited to 20 µA, while output drive capability reaches ±24 mA. Input capacitance is specified at 7 pF. The component is housed in a 48-pin SSOP package.

Feature Summary

• Dual 8-bit architecture for efficient bus-oriented data storage
• Three-state outputs enable direct system bus interconnection
• High-speed operation supporting up to 170 MHz clock frequencies

Applications

• Bus-oriented memory register applications
• High-speed data buffering systems
• Low-voltage logic interface circuits

Procurement Notes

Verify the specific suffix MEA corresponds to the 48-SSOP tube packaging configuration. Confirm that the manufacturer designation aligns with current onsemi product lines, as legacy Fairchild designations may appear in older documentation. Ensure the component meets required RoHS compliance standards for the intended manufacturing process.

Selection Notes

Select this component when designing systems requiring dual 8-bit storage with high-speed performance under low voltage conditions. The 170 MHz capability suits demanding digital interfaces. Verify that the 48-SSOP footprint matches the PCB layout constraints and that the 2V to 3.6V operating range aligns with the target power supply architecture.

Part Context

This part belongs to the LCXH series of low-voltage CMOS logic devices. It provides robust performance for modern embedded systems requiring reduced power consumption without sacrificing speed. The 16-bit capacity allows for compact implementation of wide data paths compared to discrete single-bit solutions.

Replacement Considerations

The 74LCXH16374GX serves as a pin-compatible alternative available in BGA-54 packaging. Designers must verify that the change in physical footprint does not impact existing board layouts or thermal requirements before substituting.