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74LV04D,112 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC INVERTER. Review the specifications below when checking this part for your BOM.
The Nexperia USA Inc. 74LV04D,112 is a hex inverter integrated circuit manufactured by Nexperia. It operates within a supply voltage range of 1.0 V to 5.5 V and supports an ambient temperature range from -40 °C to +125 °C. The device utilizes CMOS technology for low power dissipation and includes input clamp diodes. It complies with JEDEC standards JESD8-7, JESD8-5, JESD8C, and JESD36. The component is housed in a 14-lead SO14 plastic small outline package (SOT108-1) with a body width of 3.9 mm.
Verify the specific ordering suffix '112' against the manufacturer's current documentation to ensure correct package type and revision status. Confirm that the SO14 (SOT108-1) package variant matches the design requirements. Check for any product change notices or end-of-life announcements directly from Nexperia before finalizing procurement plans.
Select this component when a hex inverter is required for low-voltage CMOS applications operating between 1.0 V and 5.5 V. Ensure the design accommodates the specified temperature range of -40 °C to +125 °C. Verify that the 14-lead SOIC package dimensions fit the available PCB space and that the input clamp diode feature aligns with the signal interface requirements.
The 74LV04D,112 belongs to the 74LV series of high-speed low-voltage CMOS logic devices produced by Nexperia. This series is designed for applications requiring wide supply voltage ranges and low power consumption. The 'D' designation indicates the SO14 package, while ',112' specifies the tape and reel packaging configuration.
Public confirmed substitute part numbers: 74LV04PW,112 (Nexperia TSSOP14), 74LV04BQ,112 (Nexperia DHVQFN14).
Yes, the device accepts TTL input levels when the supply voltage (VCC) is between 2.7 V and 3.6 V.
The latch-up performance exceeds 100 mA per JESD 78 Class II Level B.
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