74LV244PW-Q100J

Overview

The Nexperia 74LV244PW-Q100J is an automotive-qualified octal buffer and line driver featuring three-state outputs. It operates within a supply voltage range of 1.0 V to 5.5 V and supports ambient temperatures from -40 °C to +125 °C. The device utilizes a TSSOP20 (SOT360-1) package with 20 leads. It includes two independent output enable inputs, each controlling four outputs, and incorporates input clamp diodes for interfacing with voltages exceeding VCC.

Feature Summary

• Automotive qualification in accordance with AEC-Q100 Grade 1 standards
• Wide supply voltage operation ranging from 1.0 V to 5.5 V
• High latch-up performance exceeding 100 mA per JESD 78 Class II Level B
• Robust ESD protection exceeding 2000 V via Human Body Model

Applications

• Automotive electronic systems requiring qualified logic components
• Mixed voltage level translation between 1.0 V and 5.5 V domains
• Bus-oriented transmission applications utilizing three-state control

Procurement Notes

Verify the specific ordering code matches the required temperature grade and package variant. Confirm that the application design accounts for the absolute maximum ratings, particularly regarding power dissipation derating above specified thermal thresholds. Ensure input voltage limits are respected to prevent damage to the internal clamp structures during system operation.

Selection Notes

Select this component when an octal buffer with three-state capability is required for automotive environments. The wide voltage range allows compatibility with various logic families. Consider the TSSOP20 package dimensions for PCB layout constraints. Verify that the propagation delay characteristics meet the timing requirements of the target bus architecture under the intended operating voltage conditions.

Part Context

This part belongs to the Nexperia 74LV244-Q100 family of octal buffers. It shares functional similarities with other 74LV series devices but is distinguished by its specific automotive qualification and TSSOP20 packaging. The PW suffix indicates the thin shrink small outline package variant, differentiating it from standard SOIC versions.

Replacement Considerations

Direct substitutes include the 74LV244D-Q100J, which offers identical electrical functionality but utilizes an SO20 plastic small outline package instead of the TSSOP20 form factor. Designers must verify pinout compatibility and physical footprint differences before interchange.