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74LVC06ABQ,115 is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC INVERTER 6CH 1-INP 14DHVQFN. Review the specifications below when checking this part for your BOM.
The Nexperia 74LVC06ABQ,115 is a hex inverter with open-drain outputs housed in a DHVQFN14 package (SOT762-1). It operates within a supply voltage range of 1.2 V to 5.5 V and supports inputs driven from 3.3 V or 5 V devices. The device provides five-volt tolerant inputs and outputs for interfacing with 5 V logic. It complies with JEDEC standards JESD8-7A, JESD8-5A, and JESD8-C/JESD36. ESD protection exceeds 2000 V (HBM) and 1000 V (CDM). Operating temperatures are specified from -40 °C to +85 °C and -40 °C to +125 °C.
Verify the specific ordering suffix 115 corresponds to the DHVQFN14 package variant SOT762-1 when sourcing. Confirm that the required temperature range matches the -40 °C to +125 °C specification provided in the datasheet. Ensure design compatibility with the open-drain output structure, which requires external pull-up components for proper high-state operation.
Select this component when a hex inverter with open-drain capability is required for level shifting between 1.2 V and 5.5 V domains. The DHVQFN14 package offers a compact solution for space-constrained designs. Consider the low power consumption characteristics and direct TTL interface compatibility for general-purpose digital logic inversion tasks.
This part belongs to the 74LVC06A family of hex inverters with open-drain outputs. The ABQ suffix specifically denotes the DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package without leads. This package version is designed for surface-mount applications requiring a small footprint and efficient thermal performance.
Direct replacements include other 74LVC06A variants such as the SO14 (SOT108-1) or TSSOP14 (SOT402-1) packages if pinout compatibility allows. Cross-package substitution requires verifying mechanical fit and thermal dissipation requirements against the new package outline specifications.
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