74LVC07ABQ,115

Overview

The 74LVC07ABQ,115 is a hex buffer with open-drain outputs manufactured by Nexperia. It operates within a supply voltage range of 1.2 V to 5.5 V and features Schmitt-trigger inputs for tolerance to slow signal transitions. The device provides five-volt tolerant inputs and outputs, enabling direct interfacing with TTL levels and use as translators in mixed 3.3 V and 5 V environments. It complies with JEDEC standards JESD8-7A, JESD8-5A, and JESD8-C/JESD36. ESD protection exceeds 2000 V (HBM) and 1000 V (CDM). The component is specified for ambient temperatures from -40 °C to +125 °C and utilizes the DHVQFN14 package.

Feature Summary

• Hex buffer configuration with open-drain outputs suitable for level shifting
• Five-volt tolerant inputs and outputs for mixed logic voltage interfacing
• Schmitt-trigger action at all inputs ensures tolerance to slower rise and fall times
• Compliance with multiple JEDEC standards across various supply voltage ranges

Applications

• Translating signals between 3.3 V and 5 V logic domains
• Interfacing with TTL level devices directly
• General purpose buffering in mixed voltage circuit designs

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current documentation to confirm the DHVQFN14 package type and temperature range specifications. Ensure that the procurement channel sources genuine Nexperia products to maintain compliance with the stated ESD protection ratings and operational limits defined in the product data sheet.

Selection Notes

Select this component when a hex buffer with open-drain outputs is required for driving loads at higher voltages than the logic supply. The wide supply voltage range supports operation from low-power 1.2 V systems up to standard 5.5 V interfaces. Consider the thermal performance and power dissipation derating characteristics inherent to the DHVQFN14 package for high-density applications.

Part Context

This part belongs to the 74LVC07A family of hex buffers with open-drain outputs. The 'BQ' suffix specifically denotes the DHVQFN14 plastic dual in-line compatible thermal enhanced very thin quad flat package. This package variant offers a compact footprint with dimensions of 2.5 mm by 3 mm, suitable for space-constrained surface-mount designs.

Replacement Considerations

The 74LVC07AD and 74LVC07APW are alternative packages within the same logical family but utilize SO14 and TSSOP14 footprints respectively. Direct pin-to-pin replacement requires verifying mechanical compatibility with the existing PCB layout.