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Product Detailed Parameters
- Description:IC BUF NON-INVERT 5.5V 14TSSOP
- Series:74LVC
- Mfr:Nexperia USA Inc.
- Package:Tape & Reel (TR),Cut Tape (CT)
- Logic Type:Buffer, Non-Inverting
- Number of Elements:6
- Number of Bits per Element:1
- Input Type:-
- Output Type:Open Drain
- Current - Output High, Low:-, 32mA
- Voltage - Supply:1.2V ~ 5.5V
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:14-TSSOP (0.173", 4.40mm Width)
- Supplier Device Package:14-TSSOP
- Grade:-
- Qualification:-
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Overview
The Nexperia 74LVC07APW,118 is a hex buffer with open-drain outputs housed in a TSSOP14 package (SOT402-1). It operates within a supply voltage range of 1.2 V to 5.5 V and supports inputs driven from 3.3 V or 5 V devices. The device features Schmitt-trigger action for tolerance of slow input transitions and provides direct interface capability with TTL levels. It complies with JEDEC standards for various voltage ranges and includes overvoltage tolerant inputs up to 5.5 V.
Feature Summary
- Hex buffer configuration with open-drain outputs suitable for interfacing with 5 V logic
- Schmitt-trigger inputs provide tolerance for slower input rise and fall times
- Overvoltage tolerant inputs allow operation in mixed 3.3 V and 5 V environments
Applications
- Translating signals between mixed 3.3 V and 5 V logic systems
- Buffering digital signals with open-drain output requirements
- Interfacing with TTL level logic circuits
Procurement Notes
Verify the specific ordering suffix matches the required package type, as the 74LVC07A series includes SO14, DHVQFN14, and DHXQFN14 variants. Confirm that the open-drain output characteristic aligns with the design requirements, as push-pull alternatives exist within the same family. Ensure environmental specifications meet the target operating temperature range of -40 °C to +125 °C.
Selection Notes
Select this component when an open-drain output is necessary for wired-AND configurations or level shifting to higher voltages. The wide supply voltage range allows flexibility in power supply design. Consider the TSSOP14 package dimensions if space constraints require a thin shrink small outline form factor compared to standard SO packages.
Part Context
This part belongs to the 74LVC07A family of hex buffers. While other variants like the 74LVC07AD use an SO14 package, the APW suffix specifically denotes the TSSOP14 plastic thin shrink small outline package. All variants share identical electrical characteristics but differ in physical footprint and thermal dissipation properties.
Replacement Considerations
Public confirmed substitute part numbers include 74LVC07AS14-13 from Diodes Incorporated and SN74LVC07AD from Texas Instruments.
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