74LVC1G125GM,115

Overview

The Nexperia 74LVC1G125GM,115 is a single buffer and line driver with three-state output, housed in an XSON6 (SOT886) package. It operates within a supply voltage range of 1.65 V to 5.5 V and supports overvoltage tolerant inputs up to 5.5 V. The device features Schmitt-trigger inputs for noise immunity and includes IOFF circuitry to prevent backflow current during partial power-down states. It provides ±24 mA output drive at 3.0 V and complies with JEDEC standards for various voltage levels.

Feature Summary

• IOFF circuitry enables safe partial power-down mode by disabling outputs to prevent damaging backflow currents.
• Schmitt-trigger action on all inputs ensures tolerance to slower input rise and fall times.
• Inputs are overvoltage tolerant up to 5.5 V, allowing direct interfacing with 3.3 V and 5 V devices.

Applications

• Translating signals between mixed 3.3 V and 5 V logic environments
• Partial power-down applications requiring isolation of powered-down sections
• Driving bus lines with high noise immunity requirements

Procurement Notes

Verify the specific ordering suffix

Selection Notes

Select this component when a single-channel buffer with three-state control is required in a space-constrained design. The XSON6 package offers a compact footprint suitable for portable electronics. Ensure the application utilizes the IOFF feature if the system involves partial power-down sequences to protect downstream components from back-powering.

Part Context

This part belongs to the 74LVC1G125 family of single buffers. While other variants exist in packages like TSSOP5 or SC-74A, the GM suffix specifically denotes the XSON6 plastic extremely thin small outline package. This family is designed for low-voltage CMOS applications requiring high noise immunity and flexible interface capabilities across different logic voltage domains.

Replacement Considerations

Direct pin-compatible replacements include the 74LVC1G125GW (TSSOP5) and 74LVC1G125GV (SC-74A). Verify that the alternative package meets the mechanical constraints of the PCB layout, as the XSON6 form factor differs significantly from leaded packages.