74LVC1G17GZYL

Overview

The Nexperia 74LVC1G17GZYL is a single Schmitt trigger buffer in an XSON5 (SOT8065-1) package. It operates on a supply voltage range of 1.65 V to 5.5 V with overvoltage tolerant inputs up to 5.5 V. The device provides ±24 mA output drive at 3.0 V and features IOFF circuitry for partial power-down mode operation. It complies with JEDEC standards JESD8-7, JESD8-5, JESD8C, and JESD36. Propagation delay ranges from 0.7 ns to 14.0 ns depending on voltage and temperature. ESD protection exceeds 2000 V (HBM) and 1000 V (CDM).

Feature Summary

• Schmitt-trigger action ensures tolerance to slow input rise and fall times.
• IOFF circuitry disables the output during power-down to prevent backflow current.
• Direct interface capability with TTL levels allows use as a translator in mixed 3.3 V and 5 V environments.

Applications

• Partial power-down applications requiring backflow current prevention.
• Signal translation between mixed 3.3 V and 5 V logic environments.
• Buffering signals with slow rise or fall times.

Procurement Notes

Verify the specific ordering suffix GZYL corresponds to the XSON5 (SOT8065-1) package variant with side-wettable flanks. Confirm that the component status remains active and matches the required -40 °C to +125 °C operating temperature range. Ensure compliance with RoHS3 specifications and check for any recent product change notices affecting the SOT8065-1 outline.

Selection Notes

Select this component when a single non-inverting buffer with hysteresis is required in a compact XSON5 footprint. It is suitable for designs needing direct TTL interfacing and robust noise immunity. Verify that the 5.5 V input tolerance meets system requirements without external level shifting. Consider the thermal dissipation limits associated with the small plastic thermal enhanced package.

Part Context

This part belongs to the Nexperia 74LVC1G17 family of single Schmitt trigger buffers. The 'GZ' designation specifically identifies the XSON5 (SOT8065-1) package type, which is a plastic thermal enhanced extremely thin small outline package with side-wettable flanks. This package offers five terminals and a body size of 1.1 x 0.85 x 0.5 mm.

Replacement Considerations

Other packages within the same logical family, such as 74LVC1G17GW (TSSOP5), 74LVC1G17GM (XSON6), or 74LVC1G17GN (XSON6), share identical electrical characteristics and functionality. These may serve as pin-compatible or functional alternatives if the XSON5 form factor is not strictly required.