74LVC240ADTR2G

Overview

The onsemi 74LVC240ADTR2G is an octal buffer and line driver featuring three-state outputs, designed for high-speed digital applications. It operates within a supply voltage range of 3.0 V to 3.6 V. The device provides low ON resistance and supports bidirectional data bus communication with configurable voltage translation capabilities between different power domains. It incorporates I_OFF circuitry to support partial power-down mode, preventing damaging backflow currents when the device is powered down. The component is housed in a 20-TSSOP package.

Feature Summary

• Octal buffer and line driver architecture with three-state outputs
• Configurable voltage translation for bidirectional data bus communication
• I_OFF circuitry enables partial power-down mode operation
• Low ON resistance for efficient signal transmission

Applications

• Bidirectional data bus communication systems
• Voltage level translation between 3.3 V and 5 V domains
• Partial power-down applications requiring current isolation

Procurement Notes

Verify the exact part number against official manufacturer documentation, as the provided model string may differ from standard industry naming conventions. Confirm package type and electrical specifications match the intended application requirements before procurement. Ensure compatibility with existing system voltage levels and interface standards.

Selection Notes

Select this component for designs requiring octal buffering with three-state control and bidirectional data flow. Consider its voltage translation capabilities if interfacing between 3.3 V and 5 V logic families. Evaluate the I_OFF feature for power-sensitive applications where partial shutdown is necessary. Verify package availability and lead times through authorized distributors.

Part Context

This component belongs to the 74LVC series of logic integrated circuits, known for low-voltage CMOS technology. It serves as a buffer and line driver, facilitating signal integrity in high-speed digital circuits. The TSSOP-20 package offers a compact form factor suitable for surface-mount assembly in space-constrained electronic devices.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.