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74LVC2G07GW,125 is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Nexperia USA Inc.. Its product description is IC BUF NON-INVERT 5.5V 6TSSOP. Review the specifications below when checking this part for your BOM.
The 74LVC2G07GW,125 is a dual buffer with open-drain outputs from the Nexperia LVC logic family. It operates within a supply voltage range of 1.65 V to 5.5 V and features Schmitt-trigger inputs for noise immunity. The device supports partial power-down applications via IOFF circuitry, which disables outputs to prevent backflow current when powered down. It is housed in a TSSOP6 (SOT363-2) package with a body width of 1.25 mm. Propagation delay ranges from 1.0 ns to 8.4 ns depending on voltage and temperature.
Verify the specific ordering suffix '125' against the manufacturer's official documentation to confirm packaging details such as reel or cut tape specifications. Ensure the TSSOP6 package type matches the design requirements. Cross-reference the full part number with the latest product data sheet revision to confirm compliance with current JEDEC standards and environmental directives.
Select this component for designs requiring dual buffering with open-drain capabilities in mixed-voltage systems. The wide supply voltage range allows compatibility with various logic families. Consider the thermal derating characteristics for the TSSOP6 package if operating near maximum ambient temperatures. Verify input transition rates against the recommended operating conditions to ensure signal integrity.
This component belongs to the 74LVC2G07 series, which includes variants in different packages such as SC-74 (TSOP6), XSON6, and X2SON6. All variants share the same logical function but differ in physical dimensions and thermal properties. The GW suffix specifically denotes the TSSOP6 plastic thin shrink small outline package.
Direct substitutes include other 74LVC2G07 variants with different package codes, such as 74LVC2G07GV (SC-74/TSOP6) or 74LVC2G07GM (XSON6). Ensure pinout compatibility and package dimensions match the existing footprint before substitution.
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