74LVC2G16GMH

Overview

The Nexperia 74LVC2G16GMH is a dual buffer gate manufactured in an XSON6 (SOT886) package. It operates within a supply voltage range of 1.65 V to 5.5 V and features overvoltage tolerant inputs up to 5.5 V. The device supports partial power-down mode via IOFF circuitry, which disables outputs to prevent backflow current. It complies with JEDEC standards for various voltage ranges and offers ESD protection exceeding 2000 V (HBM) and 1000 V (CDM). Operating temperatures are specified from -40 °C to +125 °C.

Feature Summary

• Dual buffer configuration with Schmitt-trigger inputs for noise immunity
• IOFF circuitry enables partial power-down mode operation
• Overvoltage tolerant inputs compatible with mixed 3.3 V and 5 V environments

Applications

• Mixed voltage translation between 3.3 V and 5 V logic levels
• Buffering signals with slow rise and fall times
• Partial power-down applications requiring output isolation

Procurement Notes

Verify the specific suffix GMH against official Nexperia documentation to confirm the exact XSON6 package variant and marking code. Ensure design compatibility with the SOT886 footprint dimensions. Confirm that the application environment remains within the specified temperature range of -40 °C to +125 °C. Validate input voltage limits relative to the supply voltage to avoid exceeding absolute maximum ratings.

Selection Notes

Select this component when a compact dual buffer solution is required for mixed-voltage systems. The XSON6 package provides space efficiency compared to larger packages. Verify that the required propagation delay and output drive capabilities meet the system specifications. Consider the IOFF feature if partial power-down functionality is necessary to reduce leakage currents during standby modes.

Part Context

The 74LVC2G16GMH belongs to the Nexperia 74LVC family of low-voltage CMOS logic devices. This series is designed for high-speed operations while maintaining low power consumption. The GMH designation specifically indicates the XSON6 plastic extremely thin small outline package without leads, suitable for surface-mount assembly on PCBs requiring minimal board space.

Replacement Considerations

The 74LVC2G16GW serves as a pin-compatible alternative in the TSSOP6 package. Verify package dimensions and thermal characteristics before substitution.