74LVC2G17GM,115

Overview

The Nexperia 74LVC2G17GM,115 is a dual non-inverting Schmitt trigger buffer housed in an XSON6 (SOT886) package. It operates within a supply voltage range of 1.65 V to 5.5 V and features overvoltage tolerant inputs up to 5.5 V. The device includes IOFF circuitry for partial power-down mode operation, preventing backflow current. It complies with JEDEC standards JESD8-7, JESD8-5, and JESD-8B/JESD36. ESD protection exceeds 2000 V (HBM Class 2) and 1000 V (CDM Class C3). Operating temperatures are specified from -40 °C to +125 °C.

Feature Summary

• Dual non-inverting buffers with Schmitt-trigger inputs for high noise immunity
• IOFF circuitry enables partial power-down mode by disabling outputs
• Overvoltage tolerant inputs allow direct interfacing with 3.3 V and 5 V devices

Applications

• Wave and pulse shapers for highly noisy environments
• Translators in mixed 3.3 V and 5 V logic environments
• Partial power-down applications requiring backflow current prevention

Procurement Notes

Verify the specific ordering suffix ',115' corresponds to the XSON6 (SOT886) package configuration as documented in the manufacturer's ordering table. Confirm that the required temperature range (-40 °C to +125 °C) aligns with the GM variant specifications. Ensure design compatibility with the stated JEDEC compliance levels and ESD protection ratings before finalizing procurement.

Selection Notes

Select this component when dual-channel buffering with Schmitt-trigger action is required in space-constrained designs utilizing the XSON6 footprint. It is suitable for interfaces between different voltage domains due to its 5.5 V input tolerance. Consider the IOFF feature if the application involves partial power-down states to protect downstream circuits from reverse currents.

Part Context

This part belongs to the Nexperia 74LVC family of low-voltage CMOS logic devices. The '2G' designation indicates a dual-gate configuration, while '17' identifies the specific function as a non-inverting Schmitt trigger. The 'GM' suffix specifies the XSON6 plastic extremely thin small outline package without leads, designed for surface-mount assembly.

Replacement Considerations

Direct substitutes include other 74LVC2G17 variants with different packages such as 74LVC2G17GW (TSSOP6), 74LVC2G17GV (TSOP6), 74LVC2G17GN (XSON6 SOT1115), or 74LVC2G17GS (XSON6 SOT1202). Verify pinout compatibility and thermal derating requirements when switching between these package types.