74LVC3G17DP,125

Overview

The Nexperia 74LVC3G17DP,125 is a triple non-inverting Schmitt trigger buffer housed in an SOT505-2 TSSOP8 package. It operates within a supply voltage range of 1.65 V to 5.5 V and supports input voltages up to 5.5 V. The device features IOFF circuitry for partial power-down applications, preventing backflow current when powered down. Static characteristics include a maximum supply current of 4 μA and input leakage current of ±1 μA at 5.5 V. Dynamic performance specifies propagation delays ranging from 1.0 ns to 13.1 ns depending on the supply voltage.

Feature Summary

• Triple non-inverting buffers with Schmitt-trigger inputs for high noise immunity
• IOFF circuitry enables partial power-down mode operation by disabling outputs
• Overvoltage tolerant inputs allow direct interfacing with 5 V devices

Applications

• Wave and pulse shapers for highly noisy environments
• Translators between mixed 3.3 V and 5 V logic environments

Procurement Notes

Verify the specific ordering suffix ',125' against the manufacturer's official documentation to confirm the exact reel quantity and packaging configuration. Confirm that the TSSOP8 (SOT505-2) package variant matches the design requirements. Ensure compliance with RoHS and REACH regulations as specified in the product data sheet before finalizing procurement.

Selection Notes

Select this component when designing circuits requiring three independent non-inverting buffers with Schmitt-trigger action. It is suitable for applications involving mixed voltage domains, specifically translating signals between 3.3 V and 5 V systems. The wide operating temperature range and low static power consumption make it appropriate for general-purpose digital logic buffering in industrial or consumer electronics.

Part Context

This part belongs to the 74LVC family of logic integrated circuits manufactured by Nexperia. The '3G' designation indicates the inclusion of three individual gates within a single package. The 'DP' suffix identifies the specific TSSOP8 plastic thin shrink small outline package with an 8-lead configuration. This series is designed for low-voltage CMOS applications requiring robust signal integrity.

Replacement Considerations

The 74LVC3G17DC,125 serves as a functional substitute using the VSSOP8 package.