74LVC3G17GF,115

Overview

The Nexperia 74LVC3G17GF,115 is a triple non-inverting Schmitt trigger buffer housed in an XSON8 package (SOT1089). It operates within a supply voltage range of 1.65 V to 5.5 V and features inputs tolerant up to 5.5 V. The device includes IOFF circuitry for partial power-down applications. Propagation delay ranges from 1.0 ns to 13.1 ns depending on voltage. Hysteresis voltage varies between 0.15 V and 1.90 V across operating conditions.

Feature Summary

• Triple non-inverting buffers with Schmitt-trigger inputs for noise immunity
• IOFF circuitry prevents damaging backflow current during partial power-down
• Inputs tolerate voltages up to 5.5 V while operating at lower supply levels

Applications

• Wave and pulse shapers for highly noisy environments
• Translators in mixed 3.3 V and 5 V logic environments
• Signal conditioning for slow input rise and fall times

Procurement Notes

Verify the specific SOT1089 package variant when ordering, as the 74LVC3G17 family includes multiple XSON8 footprints. Confirm that the application requires the specific body dimensions of 1.35 x 1 x 0.5 mm associated with this suffix. Ensure design accounts for the IOFF functionality if partial power-down states are utilized in the system architecture.

Selection Notes

Select this component when space-constrained PCB layouts require the compact XSON8 form factor. It is suitable for designs needing robust signal integrity in noisy environments due to Schmitt-trigger action. Consider the wide supply voltage compatibility if interfacing between different logic families without additional level shifting components.

Part Context

This part belongs to the 74LVC series of low-voltage CMOS logic devices. It shares functional characteristics with other members like the 74LVC3G17GT but differs in physical package dimensions. The GF suffix specifically denotes the SOT1089 outline, distinguishing it from leaded or alternative leadless packages within the same logical family.

Replacement Considerations

Direct pin-compatible substitutes include other 74LVC3G17 variants such as 74LVC3G17GT or 74LVC3G17GS, provided the board layout accommodates their respective package footprints. Verify thermal derating requirements as total power dissipation limits vary by package type.