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Product Detailed Parameters
- Description:IC BUFFER NON-INVERT 5.5V 8XSON
- Series:74LVC
- Mfr:Nexperia USA Inc.
- Package:Tape & Reel (TR),Cut Tape (CT)
- Logic Type:Buffer, Non-Inverting
- Number of Elements:3
- Number of Bits per Element:1
- Input Type:Schmitt Trigger
- Output Type:Push-Pull
- Current - Output High, Low:32mA, 32mA
- Voltage - Supply:1.65V ~ 5.5V
- Operating Temperature:-40°C ~ 125°C (TA)
- Mounting Type:Surface Mount
- Package / Case:8-XFDFN
- Supplier Device Package:8-XSON (1.35x1)
- Grade:-
- Qualification:-
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Overview
The Nexperia 74LVC3G17GS,115 is a triple non-inverting Schmitt trigger buffer housed in an XSON8 package (SOT1203). It operates within a supply voltage range of 1.65 V to 5.5 V and features overvoltage tolerant inputs up to 5.5 V. The device provides ±24 mA output drive at 3.0 V and includes IOFF circuitry for partial power-down applications. It complies with JEDEC standards JESD8-7, JESD8-5, JESD8C, and JESD36, ensuring compatibility across various voltage levels.
Feature Summary
- Triple non-inverting buffers with Schmitt-trigger inputs for high noise immunity
- Overvoltage tolerant inputs allowing direct interfacing with 5 V logic devices
- IOFF circuitry disables outputs during power-down to prevent damaging backflow current
Applications
- Wave and pulse shapers for highly noisy environments
- Translators in mixed 3.3 V and 5 V environments
- Buffering signals between different voltage domains
Procurement Notes
Verify the specific ordering suffix
Selection Notes
Select this component when triple buffering with Schmitt-trigger action is required for signal integrity in noisy environments. The wide supply voltage range supports low-power designs down to 1.65 V. Ensure the application utilizes the IOFF feature if partial power-down states are expected to protect against backflow currents.
Part Context
This part belongs to the 74LVC family of logic ICs, designed for low-voltage CMOS applications. The GS suffix indicates the XSON8 package variant (SOT1203), which offers a compact footprint suitable for space-constrained PCB layouts. It shares functional characteristics with other 74LVC3G17 variants but differs in physical packaging dimensions.
Replacement Considerations
Direct replacements include other 74LVC3G17 variants such as 74LVC3G17GT,115 or 74LVC3G17DP,125, provided the package type matches the design constraints. Verify pinout compatibility and thermal derating requirements specific to the alternative package.
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