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The 74LVC574APW,112 is a D-Type Edge Triggered Flip-Flop from the LVC logic series, manufactured by Nexperia. It contains one circuit with eight single-ended non-inverting input lines and corresponding output lines. The device operates within a supply voltage range of 1.2 V to 3.6 V and features a propagation delay of 3.2 ns at 3.3 V. It supports a high-level output current of -24 mA and is housed in a TSSOP-20 surface-mount package. The component is specified for operation between -40 °C and +125 °C.
Verify the specific ordering suffix to confirm packaging format, as the APW variant typically utilizes tube packaging distinct from reel-based alternatives. Confirm that the requested quantity aligns with the standard factory pack size of 75 units to ensure proper handling and shipping compliance. Cross-reference the manufacturer part number with official distributor catalogs to validate current production status and availability before finalizing procurement orders.
Select this component when a single eight-bit edge-triggered register is required in a compact surface-mount form factor. The LVC series offers compatibility with various logic families due to its wide voltage range. Ensure the design accommodates the TSSOP-20 thermal requirements and pinout configuration. This part is suitable for general-purpose digital logic applications requiring moderate speed and reliable data latching capabilities.
This component belongs to the 74LVC574 family of octal D-type flip-flops. The APW designation specifically indicates the TSSOP-20 plastic thin-shrink small outline package. It is part of Nexperia's broader LVC logic portfolio designed for low-voltage applications. The device serves as a fundamental building block for sequential logic circuits in consumer electronics and industrial control systems.
The 74LVC574APW,118 is a verified substitute offering identical logical function but packaged in Reel, Cut Tape, or MouseReel formats instead of tubes. Both parts share the same electrical specifications and pinout configuration, allowing for direct interchangeability in designs where packaging preference differs.