74LVC574APW,118

Overview

The Nexperia 74LVC574APW,118 is a single D-type edge-triggered flip-flop housed in a 20-pin TSSOP package. It operates within a supply voltage range of 1.2 V to 3.6 V and supports clock frequencies up to 200 MHz. The device features eight data inputs and outputs with a propagation delay of 3.2 ns at 3.3 V. It provides high drive capability with output currents of ±24 mA and low static current consumption of 10 µA. The component functions reliably across an extended temperature range from -40 °C to +125 °C.

Feature Summary

• Positive-edge triggered operation for reliable data capture
• High drive strength with ±24 mA output capability
• Wide operating voltage range supporting 1.2 V to 3.6 V systems
• Extended industrial temperature rating for harsh environments

Applications

• Parallel data storage registers
• Shift register configurations
• Interface buffering between logic families
• Timing control circuits

Procurement Notes

Verify the specific suffix '118' corresponds to the TSSOP-20 reel packaging configuration. Confirm RoHS compliance status and REACH registration details directly with the manufacturer or authorized distributors prior to finalizing procurement orders. Ensure the ordering quantity aligns with standard factory pack sizes to avoid additional handling fees.

Selection Notes

Select this component when a single 8-bit latch is required in a compact surface-mount footprint. The TSSOP-20 package offers pin compatibility with other 74LVC series devices in similar packages. Consider the 3.2 ns propagation delay and 200 MHz maximum frequency for high-speed digital applications requiring precise timing synchronization.

Part Context

This part belongs to the 74LVC family of CMOS logic integrated circuits manufactured by Nexperia. The 74LVC574 variant specifically denotes a single D-type flip-flop with 8-bit width. The APW suffix indicates the TSSOP-20 plastic package, while the ,118 code specifies the tape and reel packaging format for automated assembly processes.

Replacement Considerations

The 74LVC574AD,118 serves as a functional equivalent using SOIC-20 packaging. Designers must verify pinout compatibility and thermal characteristics when substituting between TSSOP and SOIC footprints. Other 74LVC574 variants may differ in package type or manufacturing origin.