74LVCH322244AEC;55

74LVCH322244AEC;55

  • Description:IC BUF NON-INVERT 3.6V 96LFBGA
  • Series:74LVCH
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:365a2884c505 Category: Brand:

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Product Detailed Parameters

  • Description:IC BUF NON-INVERT 3.6V 96LFBGA
  • Series:74LVCH
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Logic Type:Buffer, Non-Inverting
  • Number of Elements:8
  • Number of Bits per Element:4
  • Input Type:-
  • Output Type:3-State
  • Current - Output High, Low:12mA, 12mA
  • Voltage - Supply:1.2V ~ 3.6V
  • Operating Temperature:-40°C ~ 125°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:96-LFBGA
  • Supplier Device Package:96-LFBGA (13.5x5.5)
  • Grade:-
  • Qualification:-

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74LVCH322244AEC;55

Overview

The NXP USA Inc. 74LVCH322244AEC;55 is a 32-bit non-inverting buffer and line driver featuring 3-state outputs controlled by active LOW enable inputs (nOE). It incorporates integrated 30 Ω series termination resistors in both HIGH and LOW output stages to reduce line noise. The device supports a wide supply voltage range from 1.2 V to 3.6 V and provides 5 V tolerant inputs and outputs for mixed logic environments. Data inputs include bus hold functionality to maintain valid logic levels without external pull-up resistors.

Feature Summary

  • Integrated 30 Ω series termination resistors in output stages to minimize signal reflections and line noise
  • Bus hold circuitry on all data inputs eliminates the need for external pull-up resistors for floating or unused inputs
  • 5 V tolerant inputs and outputs allow direct interfacing with 5 V logic devices while operating at lower supply voltages
  • Low inductance multiple power and ground pins designed to reduce electromagnetic interference and ground bounce

Applications

  • Mixed 3.3 V and 5 V digital logic environments
  • High-speed data bus buffering applications
  • Line driving for printed circuit board interconnects

Procurement Notes

Verify the specific ordering suffix ;55 against current manufacturer documentation, as suffixes often denote packaging variations such as tape-and-reel quantities or tray configurations. Confirm the moisture sensitivity level and recommended reflow soldering temperature profile prior to assembly. Ensure the design accounts for the specified derating of total power dissipation above 70 °C to prevent thermal overstress during operation.

Selection Notes

Select this component when a high-density 32-bit buffer with integrated termination is required for signal integrity optimization. The LFBGA96 package offers a compact footprint suitable for space-constrained designs. Verify that the application environment remains within the specified ambient temperature ranges of -40 °C to +85 °C or -40 °C to +125 °C to ensure compliance with JEDEC standards.

Part Context

This part belongs to the 74LVCH family of low-voltage CMOS logic devices manufactured by NXP Semiconductors. The 74LVCH322244A variant specifically addresses the need for buffered line drivers with built-in termination, distinguishing it from standard buffers lacking internal resistors. It utilizes a plastic low-profile fine-pitch ball grid array package to accommodate high pin counts in a minimal surface area.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.

74LVCH322244AEC;5574LVCH322244AEC;55

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