74LVT240MTC

Overview

The Fairchild Semiconductor 74LVT240MTC is a low voltage octal buffer and line driver featuring three-state outputs. It operates within a supply voltage range of 2.7V to 3.6V. The device contains two independent buffers, each handling four bits, for a total of eight channels. It utilizes a 20-pin TSSOP package with a width of 4.4mm. The component supports high fanout capabilities and includes controlled rise and fall times to minimize signal reflections during data transmission.

Feature Summary

• Provides octal buffering and line driving functionality with three-state output control
• Features low voltage operation compatible with 3.3V logic systems
• Includes controlled slew rates to reduce electromagnetic interference and signal reflections

Applications

• Clock distribution networks in embedded systems
• Data bus buffering between microcontrollers and peripheral devices
• Memory interface buffering in consumer electronics

Procurement Notes

Verify the specific suffix designation when sourcing replacements, as variations may exist. Confirm that the supplier provides documentation acknowledging the discontinued status from Fairchild Semiconductor. Ensure the received components match the original pinout and electrical specifications required by the design. Check for RoHS compliance markings if environmental regulations apply to the final assembly.

Selection Notes

Select this component when an octal buffer with three-state capability is required for 3.3V logic applications. Consider the TSSOP-20 package constraints regarding board space and thermal dissipation. Evaluate the need for controlled rise and fall times to determine if this series meets the signal integrity requirements of the specific circuit design compared to standard speed alternatives.

Part Context

This part belongs to the 74LVT logic family, designed for low voltage digital applications. It serves as an octal buffer or line driver, distinct from non-inverting variants like the 74LVT244. The MTC suffix indicates the specific surface-mount package type used in modern electronic assemblies requiring compact footprints.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided source material.