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The Fairchild Semiconductor 74VHC175MX is an octal D-type flip-flop belonging to the 74VHC logic series. It features a single element with eight bits per element, utilizing positive-edge triggering for data capture. The device operates within a supply voltage range of 2V to 5.5V and supports surface-mount installation in a 20-TSSOP package. Key electrical parameters include a maximum propagation delay of 9.3ns at 5V with 50pF load, a clock frequency of 115 MHz, and output currents of 8mA for both high and low states. Static current consumption is specified at 4µA.
Verify that the specific part number matches the manufacturer's official documentation for the 74VHC175MX variant. Confirm package type compatibility with design constraints. Ensure compliance with relevant environmental standards such as RoHS requirements before integration. Cross-reference datasheet specifications against system operational limits to guarantee reliable performance under intended operating conditions.
Select this component when an octal storage solution with high-speed operation is required. The 74VHC series offers speed comparable to bipolar Schottky TTL while maintaining CMOS low power dissipation. Consider the 20-TSSOP package for surface-mount applications requiring compact footprint. Evaluate the 2V to 5.5V supply range against available power rails in the target design environment.
This component is part of the broader 74VHC logic family, designed for advanced high-speed CMOS applications. It provides pin and function compatibility with related devices in the series. The 74VHC175 specifically addresses needs for multi-bit synchronous data storage. It is manufactured using silicon gate CMOS technology to achieve high noise immunity and low power consumption characteristics typical of the VHC standard.
The 74VHC175MTCX serves as a verified substitute part number for this component. Both variants belong to the same logical family and share identical functional specifications. When substituting, verify package dimension compatibility between the SOIC and TSSOP form factors if physical space is constrained.