78604/4JC

Overview

The Murata Power Solutions Inc. 78604/4JC is a general-purpose pulse transformer belonging to the 786 series, designed for surface-mount applications. It features a primary-to-secondary turns ratio of 2:1 and an inductance of 100µH. The component has an ET rating of 4Vµs and operates within a temperature range of 0°C to +70°C. Its physical dimensions are 9.52mm in length, 9mm in width, and 6.35mm in height. The device utilizes a tube packaging format and is classified as a through-hole DIP end-type transformer.

Feature Summary

• Toroidal construction compatible with J-STD-020D reflow processes
• General-purpose isolation and line coupling capability
• Surface-mount design optimized for PCB integration

Applications

• Line coupling circuits
• Signal matching networks
• Isolation barriers in small isolated power supplies

Procurement Notes

Verify the specific suffix 'JC' against official datasheets to confirm it denotes the 100µH variant rather than other series configurations. Confirm RoHS3 compliance status and check for End-of-Life notifications prior to finalizing procurement plans. Ensure the selected package type matches the intended assembly process requirements.

Selection Notes

Select this component when a 2:1 turns ratio and 100µH inductance are required for general-purpose pulse transformation. Consider the 0°C to +70°C operating temperature range for environmental suitability. Evaluate the toroidal construction benefits for EMI performance in space-constrained designs requiring SMT compatibility.

Part Context

This part belongs to the 786 series of general-purpose pulse transformers from Murata Power Solutions. The series includes various variants with different inductance values and ratios, such as the 78604/4MC-R which shares similar form factors but differs in electrical specifications. The 786J designation specifically indicates the surface-mount toroidal construction style.

Replacement Considerations

The 78604/4C is a through-hole equivalent offering identical 2:1 ratio and 100µH inductance but uses a DIP package instead of surface mount. Verify mechanical footprint differences and soldering process requirements when substituting between these variants.