78P2351R-IMR/F

Overview

The 78P2351R is a single-chip Line Interface Unit (LIU) designed for 155.52 Mbit/s electrical SDH interfaces (STM1e). It performs NRZ to CMI conversion with integrated Clock & Data Recovery in both transmit and receive paths. The device interfaces to 75 Ω coaxial cable via wideband transformers, handling over 12.7 dB of cable loss. It operates from a single 3.3V supply and is housed in a 7x7mm 56-pin QFN package.

Feature Summary

• Integrated adaptive equalizer and clock recovery handle significant cable attenuation
• LVPECL-compatible system interface supports flexible NRZ to CMI conversion
• Configurable via hardware control pins or a 4-wire serial port interface
• Includes receiver Loss of Signal detection and monitor mode capabilities

Applications

• STM1e SFP modules
• SDH/ATM Line Cards
• Add Drop Multiplexers (ADMs)
• PDH/SDH Test Equipment
• Digital Microwave Radios

Procurement Notes

Verify the specific ordering suffix against the manufacturer's current datasheet to confirm temperature range and package variant. Ensure the component source is an authorized distributor to guarantee authenticity. Cross-reference the part number with the latest revision history to account for any functional updates or pinout changes.

Selection Notes

Select this component for STM1e applications requiring compact form factors. Verify that the system reference clock frequency matches the supported inputs: 19.44 MHz, 77.76 MHz, or 155.52 MHz. Confirm that the host interface supports LVPECL signaling levels for both data input and output connections.

Part Context

This device belongs to the Teridian Semiconductor family of serial line interface units, now under Analog Devices/Maxim Integrated. It serves as a second-generation solution for 155M bit/s electrical SDH interfaces, replacing discrete components with a single-chip integration for cost-efficient transceiver designs.

Replacement Considerations

Check for the 78P2351R-IM/F variant which shares identical functionality but may differ in packaging or temperature rating. Verify compatibility with existing board layouts when substituting between MLF and QFN packages.