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7A-27.000MAAE-T is listed in the Crystals range at ChipApex. The manufacturer field lists TXC CORPORATION. Its product description is CRYSTAL 27.0000MHZ 12PF SMD. Review the specifications below when checking this part for your BOM.
The 7A-27.000MAAE-T is a surface-mount crystal oscillator manufactured by TXC Corporation, operating at a nominal frequency of 27 MHz. It features a frequency tolerance of ±30 ppm and a load capacitance of 12 pF. The component utilizes a 50 Ohm equivalent series resistance (ESR) and is housed in a 2-SMD, no lead package with dimensions of 5.0 mm x 3.2 mm. Designed for commercial applications, it supports an operating temperature range from -20°C to +70°C. This device is part of the 7A series, characterized by glass-sealed construction for enhanced environmental stability.
Verify current manufacturing status as this specific part number may be classified as obsolete or end-of-life by the manufacturer. Confirm availability of active substitutes if production continuity is required. Ensure compliance with RoHS exemption requirements regarding lead content in glass seals during procurement documentation review.
Select this component when a 27 MHz clock source is required for compact consumer electronics. The 30 ppm tolerance is sufficient for general-purpose timing applications. Consider alternative frequencies within the 8-80 MHz range if system requirements differ. Verify that the 12 pF load capacitance matches the target circuit design for optimal frequency accuracy.
This component belongs to the TXC 7A series of surface-mount crystals. The series is distinguished by its 3225 (5.0x3.2mm) footprint and glass-sealing technology. It targets the commercial market segment, offering reliability improvements over traditional ceramic-packaged crystals while maintaining cost-effectiveness for high-volume consumer electronics manufacturing.
The 7M-27.000MAAE-T is listed as a similar alternative part. Verify dimensional compatibility and electrical parameter alignment before substitution. Check for any changes in mounting style or package height that might affect PCB layout constraints.
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