800-10-029-30-001000

Headers, Male Pins Overview

The Mill-Max 800-10-029-30-001000 is a surface mount pin header connector featuring 29 positions with a 0.100 inch (2.54 mm) pitch. It utilizes a push-pull fastening mechanism and solder termination for PCB attachment. The contacts are gold-plated over nickel, providing a mating contact length of 0.195 inches (4.95 mm). This component is designed for high-reliability interconnect applications requiring precise mechanical retention.

Headers, Male Pins Feature Summary

• Surface mount construction for automated assembly
• Push-pull fastening mechanism for secure locking
• Gold over nickel contact plating for corrosion resistance

Headers, Male Pins Applications

• High-density board-to-board interconnections
• Precision instrumentation signal routing
• Industrial control system backplanes

Headers, Male Pins Procurement Notes

Verify the specific suffix '30' confirms the standard gold-over-nickel plating configuration. Ensure the 29-position count matches the target circuit design requirements. Confirm surface mount footprint compatibility with existing PCB layouts before integration into production assemblies.

Headers, Male Pins Selection Notes

Select this variant when surface mount technology is required instead of through-hole options. The push-pull feature distinguishes it from standard fixed headers. Verify that the 2.54mm pitch aligns with the mating connector specifications to ensure proper mechanical engagement and electrical continuity.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 800 series of standard pin headers. The series offers various configurations including through-hole and surface mount options. The 800-10 designation indicates a standard header style with specific plating and mounting characteristics defined by the manufacturer's catalog structure.

Headers, Male Pins Replacement Considerations

Direct substitutes include other 29-position SMD headers with 2.54mm pitch and push-pull features. Cross-reference mechanical dimensions and plating thicknesses to ensure functional equivalence in high-reliability environments.