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801-87-008-66-001101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 8POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
Preci-Dip part number 801-87-008-66-001101 is a single-row socket connector from the 801 series. It features eight positions with a 0.100-inch (2.54mm) mating pitch. Designed for through-hole mounting, it utilizes push-pull fastening and accepts crimp or solder termination methods. The contacts are made of beryllium copper with gold plating on the mating interface and tin plating on the tail. The housing is constructed from black PCT polyester reinforced with glass fiber, rated UL94 V-0. Electrical ratings include 3A current capacity and 150VDC voltage tolerance, operating within a temperature range of -55°C to 125°C.
Verify that the specific ordering suffix matches the required contact plating and termination style. Confirm that the selected variant aligns with the intended PCB layout dimensions and thermal requirements. Ensure compatibility with mating header components from the same series to maintain proper engagement force and electrical continuity during operation.
Select this component when a single-row through-hole socket is required for low-to-medium density applications. Consider the gold-plated contacts for environments demanding high corrosion resistance and stable impedance. Evaluate the push-pull feature if rapid assembly and secure retention are priorities over standard solder-only mounting solutions.
This connector belongs to the Preci-Dip 801 series, which specializes in single-row socket configurations. The series offers various pin counts and termination options to support diverse PCB design needs. It complements the 800 series headers, providing a complete interconnection solution for board-to-board and cable-to-board applications requiring robust mechanical stability.
Part number 801-87-008-66-410101 serves as a parameter-equivalent alternative. Verify that the substitute maintains identical pin count, pitch, and plating specifications before implementation.
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