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801-87-014-10-012101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 14POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Preci-Dip 801-87-014-10-012101 is a single-row SIL socket connector featuring 14 positions with a 2.54 mm pitch. Designed for through-hole mounting, it utilizes straight solder tails for PCB attachment. The contacts are constructed from beryllium copper and brass, with gold plating on mating surfaces and tin plating on posts. It supports a current rating of 3A and voltage ratings of 100V AC or 150V DC. The housing is made of glass-filled polyester, operating within a temperature range of -55°C to 125°C.
Verify the specific part number against official manufacturer catalogs to confirm availability status and lead times. Ensure that the required pin count and pitch match the design specifications exactly. Check for any updated environmental compliance certifications relevant to the target market. Confirm that the through-hole soldering process aligns with the facility's thermal profile capabilities.
Select this component when a single-row, low-profile socket is required for 2.54 mm pitch applications. Consider the dual-plating scheme if both conductivity and corrosion resistance are critical. Evaluate the 3A current rating against the total load requirements of the circuit. Ensure the through-hole mounting style fits the PCB layout constraints compared to surface-mount alternatives.
This model belongs to the Preci-Dip SIL (Single In-Line) socket series, designed for high-reliability interconnect solutions. The 801 series typically offers robust mechanical performance and consistent electrical characteristics. It serves as a standard interface component in various electronic assemblies requiring durable plug-and-socket connectivity.
Direct substitutes include other 14-position, 2.54 mm pitch SIL sockets from compatible manufacturers. Verify dimensional compatibility, particularly the housing height and pin spacing. Ensure equivalent electrical ratings and material composition for seamless integration without redesign.
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