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801-87-023-65-410101 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Preci-Dip. Its product description is CONN SOCKET 23POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Preci-Dip 801-87-023-65-410101 is a rectangular connector receptacle from the 801 series, designed for board-to-board applications. It features 23 positions with a 0.100-inch (2.54mm) pitch. The component utilizes surface-mount termination and includes a push-pull locking mechanism for secure engagement. Contact surfaces are gold-plated on the mating interface and tin-plated on the tail, housed in black polyester insulation rated UL94 V-0. It operates within a temperature range of -55°C to 125°C.
Verify that the specific suffix matches the required termination style and pin count. Confirm compliance with RoHS directives if restricted substances are prohibited in your supply chain. Ensure storage conditions maintain integrity before soldering. Cross-reference the manufacturer's latest datasheet for any updates to material specifications or recommended reflow profiles to guarantee long-term reliability.
Select this model when a high-density 23-position connection is required with robust mechanical locking. The surface-mount format is suitable for space-constrained designs requiring automated placement. Consider the push-pull feature for applications needing frequent disconnection or enhanced vibration resistance compared to standard header sockets.
This component belongs to the Preci-Dip 801 series, which specializes in rectangular female socket connectors. The series offers various configurations including through-hole and surface-mount options with different pin counts. The 801-87 variant specifically denotes the surface-mount construction with push-pull latching, distinguishing it from standard press-fit or snap-in counterparts.
Direct substitutes include other Preci-Dip 801 series receptacles with identical 23-pin counts and surface-mount footprints. Verify that alternative suppliers offer matching push-pull mechanisms and gold plating thicknesses to ensure functional equivalence without redesigning the PCB layout.
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