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807-023-445-102 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 23POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 807-023-445-102 is a standard single-row card edge connector receptacle designed for high-temperature environments. It features 23 positions with a 3.96 mm (0.156 inch) contact spacing. The unit utilizes wire wrap termination and accepts board thicknesses ranging from 1.37 mm to 1.78 mm (0.054" to 0.070"). Constructed with copper alloy contacts finished in gold, the insulator is green thermoplastic polyester. It operates within a temperature range of -40°C to 125°C.
Verify specific ordering suffixes against official EDAC documentation to ensure correct tail bend and contact code configurations. Confirm RoHS compliance status directly with the manufacturer or authorized distributors prior to procurement. Check current availability as supply levels may fluctuate. Ensure the selected variant matches the required panel mount or through-hole installation style specified in the design.
Select this component when a single-row, 23-position connection is required with a 3.96 mm pitch. Verify that the daughter board thickness falls within the 1.37 mm to 1.78 mm acceptance range. Consider the high-temperature rating if the application exceeds standard operational limits. Ensure wire wrap termination compatibility with the target PCB layout and assembly tools.
This part belongs to the EDAC 807 Series, which specializes in high-temperature card edge connectors. The series provides robust interconnect solutions for sectors such as medical and agricultural technology. The 807-023 designation indicates a 23-position configuration within this specialized high-reliability family.
Cross-reference with other EDAC 807 series variants for different tail bends or contact codes. Verify mechanical dimensions and electrical ratings before substituting with generic equivalents. Consult official EDAC substitution guides for confirmed compatible alternatives.
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