SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
807-030-431-103 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 30POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC 807-030-431-103 is a standard card edge connector receptacle from the 807 High Temperature series. It features 30 positions with a 3.96 mm pitch and supports PCB thicknesses of 1.57 mm. The component utilizes gold-plated copper alloy contacts and a Diallyl Phthalate (DAP) housing. Designed for through-hole mounting at a vertical angle, it offers a current rating of 5 A and operates within a temperature range of -40°C to +125°C.
Verify the specific pin configuration and contact plating thickness against the official datasheet before procurement. Confirm that the target PCB thickness aligns with the specified 1.57 mm requirement to ensure proper mechanical engagement. Check for any recent supply chain restrictions or alternative sourcing options due to potential availability constraints.
Select this model when high-temperature stability is critical for the application environment. Ensure the design accommodates the vertical orientation and through-hole termination method. Compare against other 807 series variants if different position counts or mounting angles are required for the specific board layout.
This component belongs to the EDAC 807 series, which specializes in high-temperature card edge connectors. The series is characterized by its use of durable DAP materials and gold contacts, designed for demanding environments where standard connectors might fail due to thermal stress or oxidation.
Consult the official EDAC documentation for direct substitute part numbers within the 807 series. Verify compatibility regarding pitch, row configuration, and mounting style before considering alternatives.
Explore related parts through Connectors, Interconnects, all product categories, ChipApex homepage.