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The Oupiin 8206-2X25C30DP1T-S is a dual-edge card edge connector designed for high-reliability board-to-board or backplane interconnections. It features a 50-position female contact configuration arranged in two rows, providing robust signal and power transmission capabilities. The connector utilizes a 0.80mm (0.031 inch) pitch to support dense circuit layouts while maintaining mechanical stability. Constructed with gold-plated contacts on both edges of the card interface, it ensures low contact resistance and superior corrosion resistance for long-term performance in demanding electronic environments.
Verify that the specific suffix 'P1T' corresponds to the tape and reel packaging format required for automated assembly processes. Confirm that the 0.80mm pitch and 50-position count align precisely with the target PCB footprint and card edge thickness specifications before finalizing procurement orders to ensure mechanical compatibility.
Select this component when a dual-sided card edge interface is necessary for increased pin density within a constrained vertical profile. The 0.80mm pitch offers a balance between signal integrity and manufacturing tolerance. Ensure the mating card edge thickness falls within the connector's specified clamping range to maintain consistent contact force and prevent mechanical stress during insertion cycles.
This part belongs to the Oupiin 8206 series of edgeboard connectors, which are engineered for general-purpose electronic applications. The series typically includes various position counts and termination styles to accommodate different board architectures. As a standard industrial-grade connector, it supports common surface mount technology processes, making it suitable for mass production environments requiring consistent quality and reliability.
Direct substitutes must match the 0.80mm pitch, 50-position dual-row female configuration, and dual-edge gold contact specification. Verify that any alternative component maintains identical mounting hole patterns and overall envelope dimensions to ensure seamless integration without requiring PCB redesign.