82V2058XDAG

Overview

The 82V2058XDAG is an eight-channel E1 short haul Line Interface Unit (LIU) manufactured by Renesas Electronics. It integrates adaptive equalization, clock and data recovery, line decoding/encoding, and a jitter attenuator within a single device. The component operates on a 3.3 V power supply with a voltage range of 3.13 V to 3.47 V. It supports parallel and serial interfaces and functions within a temperature range of -40°C to +85°C. The unit is housed in a TQFP-144 package.

Feature Summary

• Integrates adaptive equalizer for signal conditioning
• Performs clock and data recovery operations
• Includes built-in jitter attenuation capabilities

Applications

• Local Area Network (LAN) infrastructure
• Wide Area Network (WAN) equipment
• Wireless base station systems
• Network gateways and routers

Procurement Notes

This component is officially designated as End-of-Life (EOL) by the manufacturer. Availability is restricted or non-existent through standard distribution channels. Verification of current stock status requires direct consultation with authorized suppliers or review of official discontinuance notifications. Procurement planning should account for limited supply constraints.

Selection Notes

Engineers requiring replacement solutions must evaluate alternative components from the same product family or newer generations. Compatibility checks regarding pin configurations and electrical specifications are essential when transitioning from this obsolete part number to active alternatives.

Part Context

The 82V2058XDAG belongs to the 82V2058 series of telecom interface ICs. It serves as the TQFP-144 variant of the 8-channel E1 LIU, distinct from other package options like the PBGA. This specific model provides high-density integration for telecommunications applications requiring multiple E1 channel interfaces.

Replacement Considerations

Official documentation lists the 82V2058BBG as an alternate package option within the same functional family. Engineers should verify mechanical fit and thermal requirements when considering package variations.