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830S21AMI-01LFT is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Renesas Electronics Corporation. Its product description is IC TRANSLTR UNIDIRECTIONAL 8SOIC. Review the specifications below when checking this part for your BOM.
The 830S21AMI-01LFT is a 1-to-1 differential-to-LVCMOS/LVTTL translator from Renesas Electronics. It accepts differential CLK and nCLK inputs supporting LVPECL, LVDS, LVHSTL, SSTL, and HCSL levels. The device provides one LVCMOS or LVTTL output with a maximum operating frequency of 350MHz. Key electrical specifications include a maximum part-to-part skew of 525ps and typical additive phase jitter of 0.11ps RMS. It operates on full 3.3V and 2.5V supply voltages within an ambient temperature range of -40°C to 85°C.
Verify the specific suffix 'LFT' indicates tape-and-reel packaging when ordering. Confirm RoHS compliance status matches project requirements. Ensure the operating temperature range aligns with environmental conditions. Check for lead-free certification documentation if required by regulatory standards. Validate pinout compatibility with existing PCB layouts before finalizing procurement.
Select this component when interfacing differential clock sources with LVCMOS or LVTTL loads. Consider the 350MHz limit for high-frequency designs. Evaluate the 8-lead SOIC footprint against available board real estate. Compare jitter performance against system timing budgets. Verify power supply requirements match available 2.5V or 3.3V rails in the target application.
This device belongs to the High Performance Clock Solutions family from IDT, now part of Renesas Electronics. It serves as a specialized translator within the broader portfolio of clock buffers and drivers. The product line focuses on providing flexible signal integrity solutions for modern digital systems requiring precise timing and level shifting capabilities across different logic families.
Consult official substitution guides for equivalent parts within the same family. Verify functional compatibility regarding input voltage levels and output drive strength. Ensure package dimensions and pin configurations match existing footprints. Review updated datasheets for any changes in electrical characteristics or recommended operating conditions.
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