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833-008-544-604 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 8POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 833-008-544-604 is a standard card edge connector from the 833 series, designed for panel mounting with a vertical orientation. It features an 8-position configuration with a 3.96 mm pitch and supports a maximum board thickness of 1.57 mm. The contacts are constructed from copper alloy with gold plating to ensure reliable signal transmission, rated at 3 A current capacity. This single-row component utilizes wire wrap termination for secure circuit board attachment.
Verify the specific manufacturer part number against official EDAC documentation to confirm compatibility with your system requirements. Ensure that the selected variant matches the required pitch, position count, and termination style. Cross-reference technical specifications such as current rating and temperature range with your design constraints before finalizing procurement decisions.
Select this component when a vertical, panel-mount card edge connector with wire wrap termination is required. Consider the 3.96 mm pitch and 1.57 mm board thickness limits during mechanical design. Verify that the 3 A current rating and DAP housing material meet the environmental and electrical demands of the target application environment.
This component belongs to the EDAC 833 series, which specializes in standard card edge connectors. The series offers various configurations tailored for robust industrial and specialized applications. The 833-008-544-604 specifically provides an eight-position interface suitable for single-row board connections within larger electronic assemblies.
Consult official EDAC substitution guides or distributor cross-reference lists for verified alternative part numbers. Ensure any replacement maintains identical pitch, position count, and termination methods to guarantee mechanical and electrical compatibility without redesigning the host assembly.
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