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833-027-524-612 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 27POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC 833-027-524-612 is a standard card edge connector from the 833 series, designed for panel mounting in a vertical orientation. It features 27 positions with a contact spacing of 3.96 mm (0.156 inches) and accepts printed circuit boards with a nominal thickness of 1.57 mm (0.062 inches). The connector utilizes gold-plated copper alloy contacts to ensure reliable signal transmission and has a current rating of 3 A. Constructed with a diallyl phthalate (DAP) insulator body, it supports solder pin termination for secure board attachment.
Verify component authenticity against official EDAC documentation before integration. Confirm that the specific suffix matches the required 27-position configuration and vertical panel mount style. Ensure compatibility with 1.57 mm PCB thickness standards. Cross-reference datasheet specifications for insulation resistance and temperature ratings to validate suitability for the intended operational environment.
Select this model when a single-row, vertical card edge connector is required for panel-mounted applications. The 3.96 mm pitch and 27-position count define the interface density. Consider the DAP housing material for environmental durability and the 3 A current rating for power distribution needs. Verify that the vertical orientation aligns with the mechanical layout constraints of the target assembly.
This component belongs to the EDAC 833 series of standard card edge connectors. The series offers various position counts and mounting angles to accommodate different interface requirements. The 833-027-524-612 specifically addresses the need for a 27-position vertical connector with robust construction materials suitable for demanding industrial and medical applications.
No public confirmed substitute part numbers are available in the provided documentation.
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