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833-062-541-204 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 62POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. model 833-062-541-204 is a standard card edge connector belonging to the 833 series. It features 62 positions with a contact spacing of 0.156 inches (3.96 mm). The component utilizes dual female contacts and is designed for panel mounting at a vertical angle. The insulator material is diallyl phthalate (DAP), and the contacts are gold-plated copper alloy. This connector supports a current rating of 3 A and operates within a temperature range of -40°C to +125°C.
Verify the specific manufacturer lead time, as distribution channels may indicate varying availability periods. Confirm RoHS compliance status through official documentation before procurement. Ensure the ordering suffix matches the required termination type and plating specifications. Cross-reference the part number with the latest datasheet to confirm dimensional tolerances and mating interface requirements.
Select this component when a 62-position vertical card edge interface is required. The 3.96 mm pitch accommodates standard PCB layouts. Verify that the application environment stays within the specified -40°C to +125°C operating range. Ensure the mating card thickness aligns with the connector's design specifications for proper retention and electrical contact.
This connector belongs to the EDAC 833 series, which provides standard card edge solutions. The series offers various position counts while maintaining consistent 3.96 mm spacing. The 833 series is characterized by its use of DAP insulators and gold-plated contacts, suitable for general-purpose industrial and commercial applications requiring durable connections.
Consult official EDAC documentation for confirmed substitute part numbers. Verify that any replacement maintains identical pin count, pitch, and mounting orientation. Ensure compatibility with existing PCB footprints and mating card dimensions.
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