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833-070-559-808 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 70POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 833-070-559-808 is a standard card edge connector from the 833 series, designed for dual-edge board insertion. It features 70 positions with a 3.96 mm (0.156 inch) pitch and supports a maximum board thickness of 1.57 mm. The component utilizes gold-plated copper alloy contacts with a cantilever contact type and solder pin termination. Rated for 3 A current, it operates within a temperature range of -40°C to +125°C and offers an insulation resistance of 5 GOhms.
Verify the specific manufacturer part number against official EDAC documentation to confirm compatibility with your design requirements. Ensure that the dual-edge female configuration aligns with your PCB layout specifications. Confirm that the solder pin termination method matches your assembly process capabilities. Check for any regional distribution restrictions or supply limitations before finalizing procurement plans.
Select this component when a high-density 70-position interface is required with a 3.96 mm pitch. The dual-row configuration is suitable for applications needing extensive I/O connections on a single edge. Verify that the 1.57 mm board thickness tolerance fits your PCB stack-up. Consider the -40°C to +125°C operating range for environmental suitability.
This connector belongs to the EDAC 833 series of standard card edge connectors. The series is characterized by its use of copper alloy contacts and gold plating for corrosion resistance. The 833 series is often utilized in specialized sectors such as medical and agricultural technologies where reliability under demanding conditions is essential.
Consult official EDAC documentation for verified substitute part numbers. Cross-reference pitch, position count, and termination style when evaluating alternatives.
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