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837-013-521-102 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 13POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-013-521-102 is a standard card edge connector from the 837 High Temp series, designed for high-temperature environments. It features 13 positions in a single row with a 3.96 mm (0.156 inch) pitch. The receptacle utilizes gold-plated copper alloy contacts and a green diallyl phthalate (DAP) insulator. It employs a solder pin termination style for secure board attachment.
Verify the specific contact count and pitch against official EDAC datasheets to confirm compatibility with target PCB designs. Ensure that the solder pin termination method aligns with available assembly processes. Confirm that the green DAP insulator material meets environmental requirements for the intended application environment.
Select this component when a single-row, high-temperature card edge connector is required. The 3.96 mm pitch accommodates standard board thicknesses. Gold plating is essential for applications where oxidation resistance is critical. Verify panel mount constraints and right-angle or straight orientation needs before finalizing the design.
This part belongs to the EDAC 837 series, which specializes in high-temperature card edge connectors. The series offers various configurations in terms of position count and termination styles. The 837-013-521-102 specifically addresses the need for 13-position connectivity with durable materials.
Consult official EDAC documentation for direct substitutes within the 837 series. Cross-reference pitch, position count, and termination type when evaluating alternative components from other manufacturers.
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