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837-025-523-101 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 25POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-025-523-101 is a single-row female card edge connector from the 837 High Temp series, designed for through-hole mounting via wire wrap termination. It features 25 positions with a 0.156-inch (3.96mm) contact spacing and accepts board thicknesses between 0.054 and 0.070 inches. The contacts are made of copper alloy with a 10.0µin gold plating, housed in green Diallyl Phthalate (DAP). Rated for -40°C to 125°C, it utilizes cantilever contacts and flush-mount flanges.
Verify the complete part number including suffix codes to ensure correct termination style and flange configuration. Confirm RoHS compliance status as required by project specifications. Check manufacturer lead times for availability. Ensure storage conditions align with component sensitivity requirements prior to assembly.
Select this model when high-temperature resistance and wire wrap termination are mandatory. The 0.156-inch pitch accommodates specific board layouts. Verify that the target circuit board thickness falls within the specified 0.054 to 0.070-inch range for proper contact engagement.
Part of the EDAC 837 High Temperature Series, characterized by robust construction for demanding environments. The series offers various pin counts and termination options. This specific variant provides a balance of thermal resilience and standard connectivity for edge-board applications.
Cross-reference with other 837-series variants for different pin counts or termination types. Verify mechanical compatibility with existing panel cutouts and board thickness constraints before substitution.
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