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837-032-558-202 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 32POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-032-558-202 is a standard card edge connector from the 837 High Temp series, designed for dual-edge board insertion. It features 32 positions with a contact spacing of 0.156 inches (3.96 mm). The connector utilizes gold-plated copper alloy contacts and a green thermoplastic polyester insulator. It supports PCB thicknesses ranging from 0.054 to 0.070 inches (1.37 mm to 1.78 mm) and operates within a temperature range of -40°C to 125°C.
Verify the specific insulator material specification against the manufacturer's current datasheet, as variations exist between DAP and polyester types within the 837 series. Confirm that the required PCB thickness falls within the specified 1.37 mm to 1.78 mm range to ensure proper mechanical fit. Check RoHS compliance status directly with the supplier, as environmental declarations may vary by production batch.
Select this component when a dual-edge connector with 32 positions and 3.96 mm spacing is required for high-temperature applications. Ensure the design accommodates the straight mounting style and straddle mount configuration. Compare against single-edge variants if board access constraints differ. Verify that the gold plating thickness meets the specific signal integrity requirements of the application.
This part belongs to the EDAC 837 High Temp series, which focuses on connectors capable of withstanding elevated temperatures beyond standard commercial grades. The series offers various position counts and mounting options, all sharing common spacing and material characteristics optimized for rugged environments.
Direct substitutes include other EDAC 837 series parts with identical 32-position dual-edge configurations, such as 837-032-558-212, provided the insulator color and exact material match the system requirements. Cross-brand replacements require careful verification of pin spacing, board thickness tolerance, and thermal rating compatibility.
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