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837-068-559-202 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 68POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 837-068-559-202 is a standard card edge connector designed for high-temperature applications within the 837 Series. It features 68 positions in a dual female configuration with a 0.156-inch (3.96mm) contact spacing. The connector utilizes gold-plated copper alloy cantilever contacts and a green diallyl phthalate (DAP) insulator. It supports through-hole mounting with wire wrap termination, accommodating PCB thicknesses between 0.054 and 0.070 inches. Operating temperatures range from -40°C to 125°C.
Verify the complete part number including suffixes to ensure correct contact configuration and tail length specifications. Confirm RoHS compliance status and environmental certifications prior to ordering. Cross-reference official datasheets for precise mechanical dimensions and mating interface requirements to guarantee compatibility with target printed circuit boards.
Select this component when dual-sided card edge connection is required for high-density signal routing. Ensure the host PCB thickness falls within the specified operational range of 0.054 to 0.070 inches. Consider the wire wrap termination style for assembly processes that do not utilize surface mount technology. Validate thermal performance requirements against the -40°C to 125°C operating range.
This connector belongs to the EDAC 837 High Temperature Series, which specializes in durable interconnect solutions for demanding environments. The series offers various position counts and configurations, maintaining consistent 0.156-inch spacing across models. It serves as a critical interface component in systems where reliability under thermal stress is paramount.
Direct substitutes within the same series include variants with different pin counts or tail lengths, such as the 837-068-559-203. Verify mechanical footprint and electrical characteristics before substituting with components from other manufacturers.
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