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845-016-542-403 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SINGLE FML 16POS 0.100. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 845-016-542-403 is a standard card edge connector from the 845 High Temp Series, designed for single-row applications with a 16-position configuration. It features a 2.54 mm (0.100 inch) contact pitch and utilizes gold-plated copper alloy contacts for reliable signal transmission. The unit employs wire wrap termination and is constructed with a green Diallyl Phthalate (DAP) insulator. Rated for 3 A current, it operates within a temperature range of -40°C to +125°C and supports PCB thicknesses up to 1.57 mm.
Verify the specific manufacturer part number against official EDAC documentation to confirm compatibility with existing board designs. Ensure that the wire wrap termination style matches the intended assembly process. Confirm that the operating temperature requirements align with the component's specified range before finalizing procurement decisions.
Select this connector when a single-row, high-temperature solution with wire wrap termination is required. The 16-position count and 2.54 mm pitch define the spatial and electrical interface constraints. Consider the DAP insulator material and gold plating for environmental resilience in industrial settings where standard connectors may fail.
This component belongs to the EDAC 845 High Temp Series, which specializes in connectors capable of withstanding elevated temperatures. The series offers various position counts and termination styles, providing flexibility for different panel-mounting needs while maintaining consistent electrical performance standards across the product line.
Consult official EDAC documentation for verified substitute part numbers within the same series or compatible families. Cross-reference pin counts, pitch dimensions, and termination types to ensure functional equivalence without altering the mechanical footprint.
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