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846-090-521-812 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 90POS 0.125. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 846-090-521-812 is a standard card edge connector receptacle designed for high-temperature applications within the 846 series. It features 90 positions with a 3.175 mm (0.125 inch) pitch, accommodating a board thickness of 1.57 mm. The component utilizes gold-plated copper alloy contacts and a Diallyl Phthalate (DAP) housing. Rated for 3 A current, it supports vertical through-hole mounting via PC pins or wire wrap termination options.
Verify the specific termination style required, as the 846 series offers both PC pin and wire wrap variants. Confirm that the selected variant matches the intended PCB assembly process. Ensure compatibility with the target board thickness of 1.57 mm to guarantee proper mechanical engagement and electrical contact integrity during installation.
Select this component when a high-density 90-position interface is necessary for vertical mounting. The 3.175 mm pitch allows for significant I/O count in a compact footprint. Consider the high-temperature rating if the operating environment exceeds standard commercial limits. Verify that the gold plating meets the specific conductivity requirements of the application.
This part belongs to the EDAC 846 series of high-temperature card edge connectors. The series is characterized by its durability and performance in harsh conditions. Variants within the series differ primarily in position count, termination method, and mounting style, allowing for flexible integration into various electronic assemblies while maintaining consistent electrical specifications.
Direct substitutes within the 846 series include parts with identical 90-position counts and 3.175 mm pitch. Verify that any replacement maintains the same vertical mounting angle and compatible termination type. Cross-reference housing material and temperature ratings to ensure equivalent environmental resilience.
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