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The Analog Devices 8551401PA is a precision voltage reference and temperature transducer IC. It provides a stable +5V output with a typical initial accuracy of 0.1% and a low temperature coefficient of 25 ppm/°C. The device operates from a supply voltage range up to 36 V maximum, drawing a maximum supply current of 1.4 mA. It features high load-driving capability, supporting up to 10 mA output current. The noise performance is specified at 0.1 Hz to 10 Hz. Packaged in an 8-CDIP (Ceramic Dual In-Line Package) with a 0.300 inch (7.62 mm) body width, it is designed for through-hole mounting.
Verify the specific suffix and package variant against the manufacturer's official datasheet before procurement. Confirm environmental compliance status and lead times directly with authorized distributors or Analog Devices. Ensure the ordering part number matches the required ceramic dual in-line package configuration. Check for any factory special order restrictions or limited distribution availability.
Select this component when a single IC solution for both voltage reference and temperature monitoring is required. Consider its 36 V input range for applications with higher supply rails. Evaluate the 25 ppm/°C drift against system accuracy needs. Verify that the 10 mA drive current meets the load requirements. Compare thermal performance and noise specifications against alternative discrete solutions.
This part belongs to Analog Devices' family of precision voltage references and signal conditioning ICs. It integrates functions typically requiring separate components, simplifying circuit design. The CDIP package offers robust mechanical stability for industrial environments. It serves as a key building block for high-accuracy analog front ends in demanding applications.
The REF02HZ is a documented comparable part. Verify pin compatibility and electrical parameter alignment before substitution. Ensure the replacement meets the same temperature coefficient and load driving requirements. Confirm package dimensions match the existing PCB footprint.