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857-035-431-108 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FML 35POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. model 857-035-431-108 is a high-temperature card edge connector receptacle from the 857 series. It features 35 positions with a 3.96 mm pitch and supports a board thickness of 1.57 mm. Designed for panel mount installation, this vertical connector utilizes gold-plated copper alloy contacts and a polyphenylene sulfide housing. The component is rated for 5 A current and offers reliable performance in demanding thermal environments.
Verify the specific ordering suffix to confirm contact plating thickness and material specifications. Ensure compatibility with the target PCB board thickness of 1.57 mm before integration. Confirm that the vertical panel mount style aligns with the enclosure design requirements. Check for any recent product change notifications regarding material composition updates.
Select this component when high-temperature stability and reliable signal integrity are critical. The 3.96 mm pitch accommodates standard card edge designs while maintaining sufficient spacing. Consider the 5 A current rating for power distribution needs within the application. Verify that the vertical orientation fits the available spatial constraints in the assembly.
This connector belongs to the EDAC 857 series, which specializes in high-temperature card edge solutions. The series is engineered for durability in harsh environments where standard connectors may fail. EDAC focuses on providing robust interconnect technologies for industrial and specialized applications requiring long-term reliability.
No public confirmed substitute part numbers are available in the provided documentation.
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