877591850

Headers, Male Pins Overview

The Molex 87759-1850 is a Milli-Grid unshrouded header connector designed for surface mount technology (SMT) applications. It features an 18-position configuration with a 2.00mm pitch, arranged in a dual-row layout. The component utilizes straight top-entry solder termination and includes press-fit plastic pegs to ensure precise alignment during automated assembly processes. This design supports reliable board-to-board connections within compact electronic systems.

Headers, Male Pins Feature Summary

• Surface mount construction with straight top-entry solder termination
• Dual-row 18-position layout optimized for high-density interconnects
• Integrated press-fit plastic pegs for accurate PCB alignment

Headers, Male Pins Applications

• Board-to-board interconnections
• High-density electronic assemblies
• Automated SMT manufacturing lines

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix to confirm contact plating thickness and material composition, as these attributes vary across the Milli-Grid series. Ensure that the selected variant matches the required lead-free compliance standards and mechanical retention specifications for the target application environment.

Headers, Male Pins Selection Notes

Select this component when a low-profile, dual-row header is required for vertical mounting on printed circuit boards. The 2.00mm pitch allows for dense pin arrangements while maintaining adequate spacing. Consider the integrated peg feature if manual handling precision is insufficient for the production workflow.

Headers, Male Pins Part Context

This part belongs to the Molex Milli-Grid family, which specializes in miniature connectors for space-constrained electronics. The 87759-1850 specifically addresses the need for robust surface-mount headers that facilitate efficient assembly through built-in positioning aids and standardized row configurations.

Headers, Male Pins Replacement Considerations

Direct substitutes must match the 18-position count, 2.00mm pitch, and SMT form factor. Verify that alternative components support identical mechanical retention via pegs or equivalent alignment mechanisms to maintain assembly quality.