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887-018-524-108 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE SGL FMALE 18POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 887-018-524-108 is a high-temperature standard card edge connector receptacle designed for single-edge board applications. It features 18 positions with a 3.96 mm (0.156 inch) contact spacing and 5.08 mm row spacing, accommodating a nominal PCB thickness of 1.57 mm (0.062 inch). The unit utilizes a black Polyphenylene Sulfide (PPS) insulator body rated UL 94V-0 and copper alloy contacts with gold plating. Rated for 3 A current, it operates within a temperature range of -40°C to +125°C. Installation is achieved via panel mount using threaded inserts compatible with 4-40 fasteners.
Verify the specific suffix codes against official EDAC documentation to confirm exact pin count, termination style, and mounting hardware compatibility. Ensure the selected variant matches the required PCB thickness and operational temperature range for the target application environment before finalizing procurement orders.
Select this component when a single-row card edge interface is required for boards with a standard 0.062-inch thickness. The 18-position count suits moderate-density connections. Consider the vertical orientation and panel-mount constraints during mechanical layout planning to ensure adequate clearance for mating cards and surrounding components.
This part belongs to the EDAC 887 series, a line of high-temperature card edge connectors. The series is characterized by its robust PPS housing and versatile termination options, including solder pins and wire hole styles. It serves as a durable solution for demanding sectors where standard connectors may fail under elevated thermal stress or physical vibration.
Consult official EDAC cross-reference guides for direct substitutes. Verify that any alternative maintains identical 3.96 mm pitch, 18-position count, and PPS material composition to ensure mechanical and electrical compatibility without redesigning the host assembly.
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