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Product Detailed Parameters
- Description：IC RF TXRX+MCU BLE 88HVQFN
- Series：-
- Mfr：NXP Semiconductors
- Package：Bulk
- Type：TxRx + MCU
- RF Family/Standard：Bluetooth, WiFi
- Protocol：802.11n/g/b, Bluetooth, Zigbee®, Z-Wave®
- Modulation：DSSS, OFDM
- Frequency：2.4GHz
- Data Rate (Max)：72.2Mbps
- Power - Output：-
- Sensitivity：-
- Memory Size：128kB ROM, 512kB SRAM
- Serial Interfaces：I2C, I2S, PWM, SPI, UART
- Voltage - Supply：3.3V
- Current - Receiving：-
- Current - Transmitting：-
- Operating Temperature：-40°C ~ 85°C (TA)
- Mounting Type：Surface Mount
- Package / Case：88-VFQFN Exposed Pad
- Supplier Device Package：88-HVQFN (10x10)
- GPIO：50
- Grade：-
- Qualification：-
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Overview
The NXP 88MW302-B0-NXUE/AK is a highly integrated, low-power WLAN Microcontroller System-on-Chip (SoC) designed for smart devices. It features an ARM Cortex-M4F core operating at up to 200 MHz with 128 kB ROM and 512 kB SRAM. The device supports IEEE 802.11 b/g/n protocols in the 2.4 GHz band and integrates Bluetooth Low Energy (BLE). It utilizes an 88-pin HVQFN package (10x10 mm) and operates on a 3.3 V supply within a temperature range of -40°C to +105°C.
Feature Summary
- Integrates Wi-Fi and BLE radio capabilities with an ARM Cortex-M4F microcontroller
- Supports IEEE 802.11 b/g/n standards for wireless communication
- Provides extensive digital interfaces including GPIO, I2C, SPI, UART, and USB
Applications
- Smart home appliances requiring wireless connectivity
- IoT sensor nodes and gateways
- Consumer electronics with embedded control needs
Procurement Notes
Verify the specific suffix code against official NXP documentation to confirm exact firmware, packaging, and regional compliance variations. Ensure the procurement channel provides valid traceability for the HVQFN package. Confirm that the ordered unit matches the required industrial temperature rating specifications.
Selection Notes
Select this component when a combined Wi-Fi and BLE solution with an integrated MCU is required. It is suitable for applications needing 802.11n performance alongside low-energy Bluetooth connectivity. Consider the 88-pin package constraints and thermal requirements for dense PCB layouts.
Part Context
This part belongs to the 88MW300/302 series of WLAN SoCs from NXP Semiconductors. These chips are engineered to reduce system complexity by combining RF transceivers with processing units. The series targets cost-sensitive and space-constrained wireless applications in the consumer and industrial sectors.
Replacement Considerations
Check NXP datasheets for pin-compatible alternatives within the same family. Verify functional equivalence regarding supported protocols and memory sizes before substitution.
